TAIPEI, Taiwan -- At the Computex trade show here today, Taiwan's Via Technologies Inc. rolled out a mobile version of its so-called VIA C3 microprocessor line, based on a 0.13-micron process technology.
Debuting at speeds of 800-MHz, the new mobile VIA C3 processor from Via features the world's smallest die size and lowest power consumption.
The processor is designed for "a complete range of full-featured, slim and light, and mini-note notebooks covering all market segments," said Wenchi Chen, president and CEO of Taipei-based Via.
Certain versions come with Via's so-called LongHaul power management technology, which can reduce the processor's voltage and clock speed to maximize battery life. Other features include 128-KB of Level 1 cache and 64-KB of Level 2 cache. It supports the 100/133-MHz Front Side Bus, MMX and 3DNow! multimedia instructions.
The processor is based on a 0.13-micron technology from Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). The mobile VIA C3 processor is available in a choice of PGA, micro PGA, and EBGA package types.
