United Business Media EE Times




Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

Intel unviels new high-speed graphics initiative








Silicon Strategies


SAN JOSE - Intel Corp. here today announced a new initiative designed to double the graphics performance for next-generation PCs and workstations.

At the Intel Developer Forum (IDF) in San Jose, the Santa Clara, Calif.-based company offered a glimpse of its new Advanced Graphics Port (AGP) 8x roadmap for next-generation graphics applications in desktops.

The AGP8x is an updated version of its previous graphics initiative, dubbed AGP4x. Like AGP4x, the new AGP8x specification implements a 32-bit wide bus. But the new specification doubles the graphics performance to 533-MHz and supports a data-transfer rate of 2-Gbytes.

Intel believes that the AGP8x specification is tuned for its upcoming Pentium 4 processor. "The forthcoming introduction of the Intel Pentium 4 processor means that the external graphics attach point must advance to take advantage of higher processor and bus speeds and meet the need for better 3-D visualization in games and on the Internet," said Pat Gelsinger, vice president and chief technology officer of the Intel Architecture Group.

"We are focusing on a unified approach that embraces all high-end PC desktop and workstation market segments," Gelsinger said. "The next part of that roadmap is AGP8x, an evolutionary step from AGP4x, to be followed by a future serial graphics bus."

The AGP8x specification also received endorsements from leading graphics vendors, such as ATI Technologies Inc., Matrox Graphics Inc., and Nvidia Corp.

"ATI has been working closely with Intel to develop a robust AGP8x bus specification, and is pleased with the increased bandwidth enabled in this new graphics attach port. ATI will offer future members of the RADEON family that fully exploit AGP8x," said Henry Quan, vice president of corporate development at ATI.

"Collaborating with Intel on the development of the AGP8x spec is particularly exciting since the extra AGP bandwidth will benefit the many innovative technologies being developed for future Matrox products," said Jean-Jacques Ostiguy, chief architect of Matrox.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready for a change?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
10 Search Engines You Don't Know About
Go beyond Google and get vertical. These specialized search sites will help you find the business information you need -- fast.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   


  Around Silicon Strategies

Challenges for 22-nm node: A team of expert analysts from Semiconductor Insights--Xu Chang, Vu Ho, Ramesh Kuchibhatla and Don Scansen--came up with a list of top challenges for the 22-nm node. Here's a list of 15 challenges (and more). More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Top 20 chip suppliers: Six of the top 10 IC companies are expected to suffer revenue declines in 2008, with the broader industry hamstrung by a ''disastrous'' year for the memory chip segment, according to iSuppli's preliminary rankings of the top 20 chip suppliers. More...

We want change!: More calls for a change in engineering education surfaced at the recent International Electron Devices Meeting (IEDM). Change is needed to become more competitive. Also see the stream of letters on the subject. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 

FEATURED TOPIC



ADDITIONAL TOPICS












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Your California Privacy Rights | Terms of Service | About