United Business Media EE Times




Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

National bundles Geode platforms with Merinta software for information appliances








Silicon Strategies


AUSTIN, Tex. -- National Semiconductor Corp. today announced a partnership with Merinta Inc. in Austin to bundle hardware platform and software solutions in development kits for so-called information appliances and home gateway Internet devices. Under a new agreement, National will combine its Geode processor-based WebPAD development kits with Merinta's iBrow end-to-end software suite.

The iBrow software and WebPAD platform will be distributed to original equipment manufacturers (OEMs), corporations, and non-branded system developers, under the agreement. Merinta said its iBrow software is highly customizable, allowing customers and partners to build and manage Internet devices while cutting development time. National and Merinta said their partnership will deliver bundled solutions based on the x86-compatible Geode processor for media-rich systems across a range of end-user markets for countertop, desktop, Web tablet, screen phone and home gateway products.

Merinta--a subsidiary of publicly-traded Boundless Corp.--and National Semiconductor said they have already successfully a handful of high-profile served customers, including Taiwan's Acer Group.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready for a change?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
10 Search Engines You Don't Know About
Go beyond Google and get vertical. These specialized search sites will help you find the business information you need -- fast.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   


  Around Silicon Strategies

Challenges for 22-nm node: A team of expert analysts from Semiconductor Insights--Xu Chang, Vu Ho, Ramesh Kuchibhatla and Don Scansen--came up with a list of top challenges for the 22-nm node. Here's a list of 15 challenges (and more). More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Top 20 chip suppliers: Six of the top 10 IC companies are expected to suffer revenue declines in 2008, with the broader industry hamstrung by a ''disastrous'' year for the memory chip segment, according to iSuppli's preliminary rankings of the top 20 chip suppliers. More...

We want change!: More calls for a change in engineering education surfaced at the recent International Electron Devices Meeting (IEDM). Change is needed to become more competitive. Also see the stream of letters on the subject. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 

FEATURED TOPIC



ADDITIONAL TOPICS












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Your California Privacy Rights | Terms of Service | About