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Silicon Strategies, an EE Times Community, is the leading news and analysis resource for semiconductor professionals. Silicon Strategies gives industry and investment professionals the most comprehensive coverage of semiconductor manufacturing and industry worldwide. Your feedback is welcome.

  Headlines for Wednesday Jan 7, 2009
Microchip slashes forecast, takes pay cuts

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Wednesday's other top stories
  • Intel says Q4 sales tumbled 23% 
  • On Semi cuts 1,500 jobs, slashes capex  
  • Fab-tool, materials sector off to rough start 
  • EC antitrust raid targets Infineon, NXP, STM 
  • DSP shipments collapse, but wireless holds up 

    News from CES
  • Webcam now goes 3-D 
  • Mitsubishi, Nvidia team up in 3DTV 
  • Toshiba forgoes 3-D, opting for Cell TV in 2009 
  • Intel makes Wi-Fi personal at CES 
  • HDMI gears up for home network role 
  • Asus reads beyond netbook at CES  
  • Europeans plan major assault on CES  
  • Verizon Wireless to support Kindle rivals 
  • SanDisk unveils memory card-based iPod competitor 
  • Monster and Gennum enable longer distance HDMI cables  
  • Conference coverage: 2009 Consumer Electronics Show 

    Business news
  • Analysis: Did Intel underestimate netbook success? 
  • DRAM revenue fell 20% in '08, says iSuppli  
  • Asyst cuts 15% of workforce, buys out JV 
  • Obama tech appointments seen coming soon 
  • Analyst sees minimal EDA growth in '09  
  • Top 20 predictions for semis in 2009 
  • Battery startup recruits 'lab-to-fab' CTO 
  • Americas actual chip sales fell 24% in November, says WSTS 

    Manufacturing news
  • Electrostatic chuck could solve EUV mask problem 

    Product news
  • Portland deploys mobile WiMax 
  • Apache rolls next-gen dynamic power integrity tool  


      Headlines for Tuesday Jan 6, 2009
    Intel could take a strategic stake in SMIC, says report

    MORE...

    Tuesday's other top stories
  • DRAM capex expected to decline by 47% in '09 
  • Tech sector faces worsening credit conditions 
  • Record VC investments for cleantech seen in '08 
  • Actual November chip sales were lowest since April 2005, says WSTS 

    News from CES
  • Updated: Samsung, SanDisk roll SSDs 
  • CES: Cisco faces challenges in consumer expansion 

    Business news
  • U.S. agency clears AMD's foundry deal 
  • Struggling Tower names new chairman 
  • Ixys reduces headcount, takes pay cuts  
  • Micrel to cut jobs after Q4 profit warning 
  • Logitech cuts jobs, abandons targets 
  • Infineon plans share issue to raise $600 million  
  • Stealthy Tabula has raised cash for PLD launch 
  • Large LCD shipments declined again in Q4, iSuppli says 

    Manufacturing news
  • Intel invests in litho source maker  

    Product news
  • Apple to sell copy protection-free songs 
  • Macworld fizzles with no Jobs or Apple surprises 


      Headlines for Monday Jan 5, 2009
    Sony denies reports of further restructuring

    MORE...

    Monday's other top stories
  • Taiwan's DRAM makers seek bailout  
  • Samsung mulls plan to hike DRAM prices 
  • Analysis: NXP's survival options must include more asset sales 

    News from CES
  • Freescale, Nvidia chase netbook sockets 
  • Intel, Adobe optimize Flash for TVs 
  • Dolby, Nvidia demo stereo 3-D at CES 
  • In tough times, CES gets smaller 
  • Ambarella pulls triple play: high-res still, HD and mobile video 

    Business news
  • Apple's Jobs reveals health problem 
  • Varian cuts revenue outlook  
  • Investor buys EDA design verification startup 
  • PLX completes acquisition of Oxford Semi 
  • LDK warns on 4th quarter, 2009 revenue 
  • Mirics raises $7 million more from VC backers 

    Technology news
  • Toshiba enters solar systems business 


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      Around Silicon Strategies

    Challenges for 22-nm node: A team of expert analysts from Semiconductor Insights--Xu Chang, Vu Ho, Ramesh Kuchibhatla and Don Scansen--came up with a list of top challenges for the 22-nm node. Here's a list of 15 challenges (and more). More...

    10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

    6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

    Top 20 chip suppliers: Six of the top 10 IC companies are expected to suffer revenue declines in 2008, with the broader industry hamstrung by a ''disastrous'' year for the memory chip segment, according to iSuppli's preliminary rankings of the top 20 chip suppliers. More...

    We want change!: More calls for a change in engineering education surfaced at the recent International Electron Devices Meeting (IEDM). Change is needed to become more competitive. Also see the stream of letters on the subject. More...

    Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

    Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

    Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

     

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